Presentation Title

Inhibiting Dendritic Growth during Electrodeposition of Copper using Additives

Faculty Mentor

Uziel Landau

Start Date

18-11-2017 1:30 PM

End Date

18-11-2017 1:45 PM

Location

9-243

Session

Engineering/CS 1

Type of Presentation

Oral Talk

Subject Area

engineering_computer_science

Abstract

Dendritic Growth may occur in rechargeable batteries during charge cycles, resulting in major issues such as short circuiting. Plating additives may provide a solution by inhibiting this growth. The effectiveness of different additives, polyethylene glycol (PEG) and polyethyleneimine (PEI) at various concentrations were studied. Copper was plated on a rotating disk electrode near the limiting current to accelerate surface roughness evolution. Overall, it was seen PEI was most effective in reducing larger dendrites (~150 µm), while PEG provided only minor inhibition. The results are further discussed and presented.

Summary of research results to be presented

The research compared the dendritic growth of copper with various additives (PEG and PEI) to when no additives were present in the system. Plating conditions were selected to ensure roughness evolution on the sample (Rotating Disk Electrode). On each plated sample, using an optical microscope, the dendritic height distribution was determined (0-200 microns). The average percent reduction in height of dendrites formed with various additives was determined. From this data, the additive (PEI) was proven to be most effective in inhibiting dendritic growth. PEI decreased overall growth of larger dendrites (150-200 microns) by 42 percent, while PEG only reduced the larger protrusions by 14 percent. It was also determined that the reduction percentage increased when Chlorine Ions were present with PEG, versus absent, however as mentioned still less effective than PEI. Secondly, the concentration of PEI was varied to find the saturation concentration under the set conditions to ensure the system was maximizing efficiency and reducing waste production. It was determined that concentrations larger than 10 ppm of PEI in the solution resulted in saturation. Once this saturation limit is obtained the reduction percentage in dendritic height reached a plateau.

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Nov 18th, 1:30 PM Nov 18th, 1:45 PM

Inhibiting Dendritic Growth during Electrodeposition of Copper using Additives

9-243

Dendritic Growth may occur in rechargeable batteries during charge cycles, resulting in major issues such as short circuiting. Plating additives may provide a solution by inhibiting this growth. The effectiveness of different additives, polyethylene glycol (PEG) and polyethyleneimine (PEI) at various concentrations were studied. Copper was plated on a rotating disk electrode near the limiting current to accelerate surface roughness evolution. Overall, it was seen PEI was most effective in reducing larger dendrites (~150 µm), while PEG provided only minor inhibition. The results are further discussed and presented.