Presentation Title

Copper/CNT based Hybrid Power Distribution Network

Faculty Mentor

Rakeshkumar Mahto

Start Date

23-11-2019 8:45 AM

End Date

23-11-2019 9:30 AM

Location

172

Session

poster 2

Type of Presentation

Poster

Subject Area

engineering_computer_science

Abstract

High current density and unidirectional flow of current makes the power distribution network on the integrated circuit (IC) susceptible to electromigration (EM) effect. As semiconductor technology progressed, due to scaling and increase in the number of the transistor in an die, the EM effect gotten worse. Hence, there was a need for a material besides copper (Cu) for increasing the reliability and service life of an IC. Owing to the strong covalent bond between carbon atoms, Carbon Nano Tube (CNT) possess a higher immunity to electromigration effect. Therefore, CNT is a promising candidate to replace Cu in the power distribution network. However, it is shown that in terms of performance, only the CNT based power distribution network provides a limited advantage over copper. Additionally, Cu has a lower resistance compared to CNT. Hence, they have a lower IR drop in the power distribution network.

In this presentation, a hybrid power distribution network of Cu/CNT is explored, such that hybrid structure can use CNT’s immunity towards EM and Cu’s lower resistance in the power distribution network. According to our findings, failure to use an optimized design technique in the hybrid structure can lead to worsening the EM effect in the copper. A mathematical model and SPICE simulation that is based on current density across the copper in the hybrid structure and Mean Time To Failure (MTTF) of the overall structure confirm our findings.

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Nov 23rd, 8:45 AM Nov 23rd, 9:30 AM

Copper/CNT based Hybrid Power Distribution Network

172

High current density and unidirectional flow of current makes the power distribution network on the integrated circuit (IC) susceptible to electromigration (EM) effect. As semiconductor technology progressed, due to scaling and increase in the number of the transistor in an die, the EM effect gotten worse. Hence, there was a need for a material besides copper (Cu) for increasing the reliability and service life of an IC. Owing to the strong covalent bond between carbon atoms, Carbon Nano Tube (CNT) possess a higher immunity to electromigration effect. Therefore, CNT is a promising candidate to replace Cu in the power distribution network. However, it is shown that in terms of performance, only the CNT based power distribution network provides a limited advantage over copper. Additionally, Cu has a lower resistance compared to CNT. Hence, they have a lower IR drop in the power distribution network.

In this presentation, a hybrid power distribution network of Cu/CNT is explored, such that hybrid structure can use CNT’s immunity towards EM and Cu’s lower resistance in the power distribution network. According to our findings, failure to use an optimized design technique in the hybrid structure can lead to worsening the EM effect in the copper. A mathematical model and SPICE simulation that is based on current density across the copper in the hybrid structure and Mean Time To Failure (MTTF) of the overall structure confirm our findings.